JPH083036Y2 - チップ型電子部品包装用カバーテープ - Google Patents
チップ型電子部品包装用カバーテープInfo
- Publication number
- JPH083036Y2 JPH083036Y2 JP1990017398U JP1739890U JPH083036Y2 JP H083036 Y2 JPH083036 Y2 JP H083036Y2 JP 1990017398 U JP1990017398 U JP 1990017398U JP 1739890 U JP1739890 U JP 1739890U JP H083036 Y2 JPH083036 Y2 JP H083036Y2
- Authority
- JP
- Japan
- Prior art keywords
- cover tape
- layer
- tape
- strength
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title claims description 4
- 239000010410 layer Substances 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 229920003023 plastic Polymers 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 238000009751 slip forming Methods 0.000 claims description 3
- 238000002834 transmittance Methods 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims description 2
- 239000004920 heat-sealing lacquer Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000004922 lacquer Substances 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- 230000009191 jumping Effects 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229920006378 biaxially oriented polypropylene Polymers 0.000 description 1
- 239000011127 biaxially oriented polypropylene Substances 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920006284 nylon film Polymers 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
- Packages (AREA)
- Wrappers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990017398U JPH083036Y2 (ja) | 1990-02-26 | 1990-02-26 | チップ型電子部品包装用カバーテープ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990017398U JPH083036Y2 (ja) | 1990-02-26 | 1990-02-26 | チップ型電子部品包装用カバーテープ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03109398U JPH03109398U (en]) | 1991-11-11 |
| JPH083036Y2 true JPH083036Y2 (ja) | 1996-01-29 |
Family
ID=31520610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990017398U Expired - Fee Related JPH083036Y2 (ja) | 1990-02-26 | 1990-02-26 | チップ型電子部品包装用カバーテープ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH083036Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3201507B2 (ja) * | 1995-05-30 | 2001-08-20 | 住友ベークライト株式会社 | 電子部品包装用カバーテープ |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6145380U (ja) * | 1984-08-29 | 1986-03-26 | 大日本印刷株式会社 | 電子部品用のテ−ピング包装材料 |
| JPH057161Y2 (en]) * | 1987-03-24 | 1993-02-23 | ||
| JP3064256U (ja) * | 1999-05-26 | 2000-01-07 | 株式会社川善 | 皿型装飾品 |
-
1990
- 1990-02-26 JP JP1990017398U patent/JPH083036Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03109398U (en]) | 1991-11-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |